XC3S200-4FT256C

Product Overview

Category

The XC3S200-4FT256C belongs to the category of Field-Programmable Gate Arrays (FPGAs).

Use

FPGAs are integrated circuits that can be programmed after manufacturing. They are widely used in various electronic applications, including telecommunications, automotive, aerospace, and consumer electronics.

Characteristics

• The XC3S200-4FT256C is a high-performance FPGA with advanced features.
• It offers a large number of configurable logic blocks and programmable interconnects.
• It provides flexibility and versatility in designing digital circuits.
• The FPGA supports various communication protocols and interfaces.
• It has low power consumption and high-speed performance.

Package

The XC3S200-4FT256C comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of the XC3S200-4FT256C lies in its ability to provide reconfigurable hardware for implementing complex digital systems.

Packaging/Quantity

The XC3S200-4FT256C is typically sold individually or in reels containing multiple units. The exact quantity depends on the supplier and customer requirements.

Specifications

• Logic Cells: 200,000
• Flip-Flops: 64,000
• Block RAM: 648 Kb
• DSP Slices: 120
• Maximum Operating Frequency: 400 MHz
• I/O Pins: 208
• Voltage Range: 1.14V - 1.26V
• Operating Temperature Range: -40°C to 100°C

Detailed Pin Configuration

The XC3S200-4FT256C has a total of 256 pins. These pins are assigned to various functions such as input/output, clock signals, power supply, and configuration.

For a detailed pin configuration diagram, please refer to the datasheet provided by the manufacturer.

Functional Features

• High-density programmable logic for complex digital circuit implementation.
• Flexible and reconfigurable architecture for easy design modifications.
• Support for various communication protocols such as UART, SPI, I2C, and Ethernet.
• On-chip memory blocks for efficient data storage and retrieval.
• Dedicated Digital Signal Processing (DSP) slices for signal processing applications.
• Built-in clock management resources for precise timing control.

Advantages and Disadvantages

Advantages

• Versatile and adaptable for a wide range of applications.
• Faster time-to-market compared to custom ASIC designs.
• Lower development costs due to reusability and flexibility.
• Ability to implement complex algorithms and functions in hardware.
• Easy integration with other electronic components.

Disadvantages

• Higher power consumption compared to dedicated application-specific chips.
• Limited performance compared to specialized hardware for specific tasks.
• Steeper learning curve for designers unfamiliar with FPGA programming.
• Higher cost per unit compared to mass-produced standard integrated circuits.

Working Principles

FPGAs like the XC3S200-4FT256C consist of an array of configurable logic blocks interconnected through programmable routing resources. These logic blocks can be programmed to perform specific functions using a Hardware Description Language (HDL) or graphical tools.

During operation, the FPGA is configured by loading a bitstream that defines the desired circuit functionality. The internal programmable interconnects are then set according to the configuration, allowing data to flow through the logic blocks and produce the desired output.

Detailed Application Field Plans

The XC3S200-4FT256C finds applications in various fields, including:

1. Telecommunications: Used in base stations, network routers, and switches for high-speed data processing and protocol handling.
2. Automotive: Employed in advanced driver assistance systems (ADAS), engine control units (ECUs), and infotainment systems for enhanced functionality and performance.
3. Aerospace: Utilized in satellite communication systems, avionics, and flight control systems for reliable and efficient data processing.
4. Consumer Electronics: Integrated into smart TVs, gaming consoles, and wearable devices to enable complex multimedia processing and connectivity features.

Detailed and Complete Alternative Models

1. XC3S50-4TQG144C: A smaller FPGA with 50,000 logic cells and 144-pin Thin Quad Flat Pack (TQFP) package.
2. XC3S1000-4FG456I: A larger FPGA with 1,000,000 logic cells and 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
3. XC3S4000-4FG900C: A high-capacity FPGA with 4,000,000 logic cells and 900-pin Fine-Pitch Ball Grid Array (FBGA) package.

These alternative models offer different levels of logic capacity, pin count, and package options to cater to specific design requirements.

In conclusion, the XC3S200-