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LH28F320S3HNS-L11

LH28F320S3HNS-L11

Product Overview

Category

The LH28F320S3HNS-L11 belongs to the category of flash memory devices.

Use

This product is primarily used for data storage in various electronic devices, such as smartphones, tablets, digital cameras, and portable media players.

Characteristics

  • High storage capacity: The LH28F320S3HNS-L11 offers a large storage capacity of 320 megabits (40 megabytes), allowing users to store a significant amount of data.
  • Fast data transfer rate: With its high-speed interface, this flash memory device enables quick data transfer between the device and the host system.
  • Reliable performance: The LH28F320S3HNS-L11 is designed to provide reliable and consistent performance, ensuring the integrity and security of stored data.
  • Low power consumption: This flash memory device is energy-efficient, consuming minimal power during operation, which helps prolong battery life in portable devices.
  • Compact package: The LH28F320S3HNS-L11 is available in a compact package, making it suitable for integration into small-sized electronic devices.

Packaging/Quantity

The LH28F320S3HNS-L11 is typically packaged in a surface-mount package, which facilitates easy installation on printed circuit boards (PCBs). It is commonly available in reels or trays, with quantities varying based on customer requirements.

Specifications

  • Memory Type: Flash
  • Memory Size: 320 Megabits (40 Megabytes)
  • Interface: Parallel
  • Supply Voltage: 2.7V - 3.6V
  • Operating Temperature Range: -40°C to +85°C
  • Package Type: TSOP (Thin Small Outline Package)

Detailed Pin Configuration

The LH28F320S3HNS-L11 features a parallel interface with a total of 48 pins. The pin configuration is as follows:

  1. VCC
  2. A0
  3. A1
  4. A2
  5. A3
  6. A4
  7. A5
  8. A6
  9. A7
  10. A8
  11. A9
  12. A10
  13. A11
  14. A12
  15. A13
  16. A14
  17. A15
  18. A16
  19. A17
  20. A18
  21. A19
  22. A20
  23. A21
  24. A22
  25. A23
  26. A24
  27. A25
  28. A26
  29. A27
  30. A28
  31. A29
  32. A30
  33. A31
  34. DQ0
  35. DQ1
  36. DQ2
  37. DQ3
  38. DQ4
  39. DQ5
  40. DQ6
  41. DQ7
  42. WE#
  43. CE#
  44. OE#
  45. BYTE#
  46. RY/BY#
  47. NC (No Connection)
  48. GND

Functional Features

  • Erase and Program Operations: The LH28F320S3HNS-L11 supports both erase and program operations, allowing users to modify the stored data as needed.
  • Block Locking: This flash memory device offers block locking functionality, which enables users to protect specific blocks of data from being modified or erased.
  • Read and Write Speed: With its high-speed interface, the LH28F320S3HNS-L11 provides fast read and write speeds, ensuring efficient data access and transfer.

Advantages and Disadvantages

Advantages

  • High storage capacity allows for ample data storage.
  • Fast data transfer rate enhances overall system performance.
  • Reliable performance ensures data integrity and security.
  • Low power consumption prolongs battery life in portable devices.
  • Compact package facilitates integration into small-sized electronic devices.

Disadvantages

  • Limited compatibility with certain older systems that do not support parallel interfaces.
  • Higher cost compared to lower-capacity flash memory options.

Working Principles

The LH28F320S3HNS-L11 utilizes the principles of flash memory technology. It stores data by trapping electric charges within floating gate transistors, which can be electrically programmed or erased. When data is written, a high voltage is applied to the control gate, allowing electrons to tunnel through the insulating layer and become trapped in the floating gate. To erase data, a higher voltage is applied, removing the trapped electrons. This process enables the LH28F320S3HNS-L11 to retain stored data even when power is disconnected.

Detailed Application Field Plans

The LH28F320S3HNS-L11 finds applications in various electronic devices that require non-volatile storage capabilities. Some potential application fields include:

  1. Smartphones

Liste 10 perguntas e respostas comuns relacionadas à aplicação de LH28F320S3HNS-L11 em soluções técnicas

Sure! Here are 10 common questions and answers related to the application of LH28F320S3HNS-L11 in technical solutions:

  1. Q: What is LH28F320S3HNS-L11? A: LH28F320S3HNS-L11 is a specific model of flash memory chip manufactured by a company called Samsung.

  2. Q: What is the capacity of LH28F320S3HNS-L11? A: LH28F320S3HNS-L11 has a capacity of 32 megabits (4 megabytes).

  3. Q: What is the interface used by LH28F320S3HNS-L11? A: LH28F320S3HNS-L11 uses a parallel interface for data transfer.

  4. Q: What voltage does LH28F320S3HNS-L11 operate at? A: LH28F320S3HNS-L11 operates at a voltage range of 2.7V to 3.6V.

  5. Q: Can LH28F320S3HNS-L11 be used in industrial applications? A: Yes, LH28F320S3HNS-L11 is suitable for use in industrial applications due to its wide operating temperature range and reliability.

  6. Q: Is LH28F320S3HNS-L11 compatible with other microcontrollers or processors? A: Yes, LH28F320S3HNS-L11 can be interfaced with various microcontrollers and processors that support parallel flash memory.

  7. Q: Does LH28F320S3HNS-L11 support in-system programming? A: Yes, LH28F320S3HNS-L11 supports in-system programming, allowing for firmware updates without removing the chip from the system.

  8. Q: What is the typical access time of LH28F320S3HNS-L11? A: The typical access time of LH28F320S3HNS-L11 is around 70 nanoseconds.

  9. Q: Can LH28F320S3HNS-L11 be used as a boot device in embedded systems? A: Yes, LH28F320S3HNS-L11 can be used as a boot device to store the initial program code in embedded systems.

  10. Q: Are there any specific precautions to take when handling LH28F320S3HNS-L11? A: It is recommended to follow proper ESD (electrostatic discharge) precautions while handling LH28F320S3HNS-L11 to prevent damage to the chip.

Please note that these answers are general and may vary depending on the specific requirements and documentation provided by Samsung for LH28F320S3HNS-L11.