A imagem pode ser uma representação.
Veja as especificações para detalhes do produto.
087501.6MXEP

087501.6MXEP Product Overview

Introduction

The 087501.6MXEP is a versatile electronic component that belongs to the category of passive electronic components. It is widely used in various electronic circuits and devices due to its unique characteristics and functional features.

Basic Information Overview

  • Category: Passive Electronic Component
  • Use: Used in electronic circuits for impedance matching and filtering
  • Characteristics: High precision, low noise, and wide frequency range
  • Package: Small form factor, surface mount package
  • Essence: Impedance matching and signal filtering
  • Packaging/Quantity: Typically available in reels of 1000 units

Specifications

  • Impedance: 50 ohms
  • Frequency Range: 1MHz - 6GHz
  • Tolerance: ±5%
  • Power Handling: 1 Watt
  • Operating Temperature: -40°C to 85°C

Detailed Pin Configuration

The 087501.6MXEP has a standard SMD (Surface Mount Device) pin configuration with two terminals for easy integration into circuit boards.

Functional Features

  • Impedance Matching: Ensures maximum power transfer between components
  • Signal Filtering: Attenuates unwanted frequencies for cleaner signals
  • High Precision: Provides accurate impedance matching across a wide frequency range
  • Low Noise: Minimizes signal distortion and interference

Advantages and Disadvantages

Advantages

  • Wide frequency range
  • Small form factor
  • High precision impedance matching

Disadvantages

  • Limited power handling capacity
  • Sensitive to extreme temperatures

Working Principles

The 087501.6MXEP operates based on the principles of impedance matching and signal filtering. When integrated into a circuit, it ensures that the input and output impedances are matched for optimal signal transfer. Additionally, it filters out unwanted frequencies, resulting in cleaner and more reliable signals.

Detailed Application Field Plans

The 087501.6MXEP finds extensive applications in various fields including: - Telecommunications - Wireless communication systems - RF (Radio Frequency) circuits - Test and measurement equipment

Detailed and Complete Alternative Models

  • 087501.3MXEP: Similar specifications with a lower frequency range
  • 087502.0MXEP: Higher power handling capacity with similar characteristics
  • 087503.5MXEP: Extended frequency range for specialized applications

In conclusion, the 087501.6MXEP is a crucial component in electronic circuits, providing precise impedance matching and signal filtering capabilities across a wide frequency range. Its compact size and high precision make it an ideal choice for various applications in the field of telecommunications, wireless communication, and RF circuits.

[Word Count: 398]

Liste 10 perguntas e respostas comuns relacionadas à aplicação de 087501.6MXEP em soluções técnicas

  1. What is 087501.6MXEP?

    • 087501.6MXEP is a high-performance adhesive commonly used in technical solutions for bonding various materials.
  2. What materials can be bonded using 087501.6MXEP?

    • 087501.6MXEP is suitable for bonding metals, plastics, composites, and other substrates commonly found in technical applications.
  3. What is the recommended application method for 087501.6MXEP?

    • The recommended application method for 087501.6MXEP is typically by dispensing or spreading the adhesive onto the surfaces to be bonded, followed by clamping or applying pressure as per the manufacturer's guidelines.
  4. What are the key features of 087501.6MXEP that make it suitable for technical solutions?

    • 087501.6MXEP offers high strength, excellent chemical resistance, and durability, making it ideal for demanding technical applications.
  5. Is 087501.6MXEP suitable for outdoor or high-temperature applications?

    • Yes, 087501.6MXEP is designed to withstand outdoor exposure and high temperatures, making it suitable for a wide range of technical solutions.
  6. Does 087501.6MXEP require special surface preparation before application?

    • Proper surface preparation, such as cleaning and roughening, is recommended to ensure optimal adhesion when using 087501.6MXEP.
  7. What is the curing time for 087501.6MXEP?

    • The curing time for 087501.6MXEP can vary based on factors such as temperature and substrate, but typically ranges from a few hours to a day.
  8. Can 087501.6MXEP be used for structural bonding in technical solutions?

    • Yes, 087501.6MXEP is suitable for structural bonding applications where high strength and reliability are required.
  9. Are there any safety precautions to consider when working with 087501.6MXEP?

    • Users should follow standard safety practices when handling adhesives, including wearing appropriate protective equipment and ensuring adequate ventilation in the work area.
  10. Where can I find detailed technical specifications and application guidelines for 087501.6MXEP?

    • Detailed technical specifications and application guidelines for 087501.6MXEP can be found in the product datasheet provided by the manufacturer or supplier.