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AS4C8M16SA-6TCN

AS4C8M16SA-6TCN

Product Overview

Category

The AS4C8M16SA-6TCN belongs to the category of dynamic random-access memory (DRAM) chips.

Use

It is used as a primary storage component in various electronic devices such as computers, smartphones, and networking equipment.

Characteristics

  • High-speed operation
  • Low power consumption
  • Compact package size
  • Wide operating temperature range

Package

The AS4C8M16SA-6TCN is typically available in surface-mount packages for easy integration into circuit boards.

Essence

This DRAM chip is essential for providing temporary data storage and quick access to information for electronic devices.

Packaging/Quantity

The AS4C8M16SA-6TCN is commonly packaged in reels or trays and is available in varying quantities depending on the manufacturer's specifications.

Specifications

  • Memory Size: 128Mb
  • Organization: 8M words × 16 bits
  • Speed: 6ns
  • Voltage: 3.3V ± 0.3V
  • Operating Temperature: -40°C to +85°C
  • Package Type: 54-ball FBGA

Detailed Pin Configuration

The AS4C8M16SA-6TCN features a 54-ball fine-pitch ball grid array (FBGA) package with specific pin assignments for power, address, data, and control signals. The detailed pin configuration can be found in the product datasheet provided by the manufacturer.

Functional Features

  • Fast data access and retrieval
  • Low standby power consumption
  • Self-refresh capability for power savings
  • Internal precharge and auto refresh

Advantages and Disadvantages

Advantages

  • High-speed operation enhances overall system performance
  • Low power consumption prolongs battery life in portable devices
  • Compact package size allows for space-efficient designs

Disadvantages

  • Susceptible to data loss without power backup
  • Relatively higher cost compared to other types of memory

Working Principles

The AS4C8M16SA-6TCN operates based on the principles of charge storage within individual memory cells, which are accessed and refreshed dynamically to maintain data integrity.

Detailed Application Field Plans

The AS4C8M16SA-6TCN is suitable for a wide range of applications including: - Computer systems - Mobile devices - Networking equipment - Industrial automation - Automotive electronics

Detailed and Complete Alternative Models

  • AS4C8M16SB-6TIN
  • MT48LC8M16A2P-6A
  • K4S561632E-TC75

In conclusion, the AS4C8M16SA-6TCN is a versatile DRAM chip with high-speed operation, low power consumption, and compact packaging, making it an ideal choice for various electronic applications.

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Liste 10 perguntas e respostas comuns relacionadas à aplicação de AS4C8M16SA-6TCN em soluções técnicas

  1. What is the AS4C8M16SA-6TCN?

    • The AS4C8M16SA-6TCN is a 128Mb CMOS Synchronous DRAM (SDRAM) organized as 8M words by 16 bits.
  2. What are the typical applications of AS4C8M16SA-6TCN?

    • It is commonly used in networking equipment, telecommunications systems, industrial control systems, and other embedded applications.
  3. What is the operating voltage range for AS4C8M16SA-6TCN?

    • The operating voltage range is typically 2.5V to 3.3V.
  4. What is the maximum clock frequency supported by AS4C8M16SA-6TCN?

    • The maximum clock frequency supported is 166MHz.
  5. What are the key features of AS4C8M16SA-6TCN?

    • Some key features include burst read and write operations, programmable burst length, auto precharge, and more.
  6. Is AS4C8M16SA-6TCN compatible with lead-free assembly processes?

    • Yes, it is compatible with lead-free assembly processes.
  7. What is the temperature range for AS4C8M16SA-6TCN?

    • The temperature range is typically -40°C to 85°C.
  8. Does AS4C8M16SA-6TCN support self-refresh mode?

    • Yes, it supports a self-refresh mode for low power consumption.
  9. What are the package options available for AS4C8M16SA-6TCN?

    • The AS4C8M16SA-6TCN is available in various package options such as TSOP, BGA, and FBGA.
  10. Are there any specific design considerations when using AS4C8M16SA-6TCN in a technical solution?

    • Designers should consider signal integrity, PCB layout, decoupling capacitors, and timing parameters to ensure optimal performance.