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AS4C64M8D3-12BIN

AS4C64M8D3-12BIN

Product Overview

Category

The AS4C64M8D3-12BIN belongs to the category of dynamic random-access memory (DRAM) modules.

Use

It is used as a primary storage component in various electronic devices such as computers, smartphones, and networking equipment.

Characteristics

  • High-speed operation
  • Low power consumption
  • Compact package size
  • Wide operating temperature range

Package

The AS4C64M8D3-12BIN is typically packaged in a small outline dual in-line memory module (SODIMM) form factor.

Essence

The essence of the AS4C64M8D3-12BIN lies in its ability to provide fast and efficient data storage and retrieval for electronic devices.

Packaging/Quantity

The AS4C64M8D3-12BIN is commonly available in individual packaging and is often sold in quantities of one or multiples depending on the customer's requirements.

Specifications

  • Part Number: AS4C64M8D3-12BIN
  • Memory Type: DDR3 SDRAM
  • Capacity: 512MB
  • Speed: 1200MHz
  • Voltage: 1.5V
  • Organization: 64M words x 8 bits
  • Interface: 204-pin SODIMM

Detailed Pin Configuration

The AS4C64M8D3-12BIN features a 204-pin SODIMM interface with a specific pin configuration that allows for seamless integration into compatible devices. The detailed pin configuration can be found in the product datasheet provided by the manufacturer.

Functional Features

  • Fast data access and transfer speeds
  • Low power consumption for energy efficiency
  • Reliable data storage and retrieval
  • Compatibility with a wide range of electronic devices

Advantages and Disadvantages

Advantages

  • High-speed operation enhances overall system performance
  • Low power consumption prolongs battery life in portable devices
  • Compact form factor enables installation in space-constrained environments

Disadvantages

  • Limited capacity compared to higher-end DRAM modules
  • May not be compatible with older device models due to technology advancements

Working Principles

The AS4C64M8D3-12BIN operates based on the principles of dynamic random-access memory, utilizing electrical charges to store and retrieve data rapidly within electronic devices.

Detailed Application Field Plans

The AS4C64M8D3-12BIN is well-suited for use in a variety of applications, including: - Laptop and desktop computers - Mobile devices such as smartphones and tablets - Networking equipment and routers - Industrial control systems and embedded devices

Detailed and Complete Alternative Models

  • AS4C64M8D3A-12BIN
  • AS4C64M8D3B-12BIN
  • AS4C64M8D3C-12BIN

In summary, the AS4C64M8D3-12BIN is a DDR3 SDRAM module designed to provide high-speed, low-power data storage and retrieval capabilities for a wide range of electronic devices. Its compact form factor, functional features, and compatibility make it a versatile solution for various applications.

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Liste 10 perguntas e respostas comuns relacionadas à aplicação de AS4C64M8D3-12BIN em soluções técnicas

  1. What is the AS4C64M8D3-12BIN?

    • The AS4C64M8D3-12BIN is a 512Mb DDR3 SDRAM component designed for use in various electronic devices and systems.
  2. What are the key features of the AS4C64M8D3-12BIN?

    • The AS4C64M8D3-12BIN features a high-speed data transfer rate, low power consumption, and compatibility with a wide range of applications.
  3. In what types of technical solutions can the AS4C64M8D3-12BIN be used?

    • The AS4C64M8D3-12BIN can be used in applications such as computer systems, networking equipment, industrial machinery, and consumer electronics.
  4. What is the operating voltage range of the AS4C64M8D3-12BIN?

    • The AS4C64M8D3-12BIN operates within a voltage range of 1.425V to 1.575V.
  5. What is the maximum clock frequency supported by the AS4C64M8D3-12BIN?

    • The AS4C64M8D3-12BIN supports a maximum clock frequency of 800MHz.
  6. Does the AS4C64M8D3-12BIN support auto-refresh and self-refresh modes?

    • Yes, the AS4C64M8D3-12BIN supports both auto-refresh and self-refresh modes, contributing to power efficiency.
  7. What are the temperature specifications for the AS4C64M8D3-12BIN?

    • The AS4C64M8D3-12BIN has an operating temperature range of 0°C to 95°C.
  8. Is the AS4C64M8D3-12BIN RoHS compliant?

    • Yes, the AS4C64M8D3-12BIN is RoHS compliant, meeting environmental standards.
  9. Can the AS4C64M8D3-12BIN be used in automotive applications?

    • Yes, the AS4C64M8D3-12BIN is suitable for use in automotive applications, provided that the operating conditions are within the specified range.
  10. What are some common design considerations when integrating the AS4C64M8D3-12BIN into a technical solution?

    • Design considerations include signal integrity, PCB layout, power supply decoupling, and ensuring compatibility with the overall system architecture.