Alliance Memory, Inc.
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AS4C64M8D2-25BIN
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AS4C64M8D2-25BIN

Product Overview

Category

AS4C64M8D2-25BIN belongs to the category of semiconductor memory devices.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and embedded systems.

Characteristics

  • High-speed operation
  • Low power consumption
  • Large storage capacity
  • Compact package size
  • Reliable performance

Package

AS4C64M8D2-25BIN is available in a small outline dual in-line memory module (SODIMM) package.

Essence

The essence of AS4C64M8D2-25BIN lies in its ability to store and retrieve digital information quickly and efficiently.

Packaging/Quantity

This product is typically packaged in trays or reels, with each containing a specific quantity of AS4C64M8D2-25BIN units.

Specifications

  • Part Number: AS4C64M8D2-25BIN
  • Memory Type: Synchronous Dynamic Random Access Memory (SDRAM)
  • Organization: 64 Megabit x 8
  • Operating Voltage: 2.5V
  • Speed Grade: 25ns
  • Interface: Parallel
  • Pin Count: 66 pins
  • Data Rate: 200 MHz
  • Refresh Mode: Auto-refresh and self-refresh
  • Temperature Range: -40°C to +85°C

Detailed Pin Configuration

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. VSS
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. /CAS
  37. /RAS
  38. /WE
  39. /CS0
  40. /CS1
  41. /CS2
  42. /CS3
  43. /CS4
  44. /CS5
  45. /CS6
  46. /CS7
  47. /CKE
  48. /CLK
  49. /DQM0
  50. /DQM1
  51. /DQM2
  52. /DQM3
  53. /DQM4
  54. /DQM5
  55. /DQM6
  56. /DQM7
  57. VDD
  58. VDD
  59. VDD
  60. VDD
  61. VSS
  62. VSS
  63. VSS
  64. VSS
  65. NC
  66. VDDSPD

Functional Features

  • High-speed data transfer
  • Burst mode operation
  • On-die termination (ODT) for improved signal integrity
  • Auto and self-refresh capabilities
  • Low power standby mode
  • Easy integration into various systems

Advantages and Disadvantages

Advantages

  • Fast data access and retrieval
  • Low power consumption
  • Compact form factor
  • Reliable performance
  • Wide temperature range support

Disadvantages

  • Limited storage capacity compared to other memory technologies
  • Higher cost per unit compared to some alternative models

Working Principles

AS4C64M8D2-25BIN operates based on the principles of synchronous dynamic random access memory (SDRAM). It stores digital information in a matrix of capacitors, with each capacitor representing a single bit of data. The memory cells are organized into rows and columns, allowing for efficient read and write operations.

Detailed Application Field Plans

AS4C64M8D2-25BIN finds applications in various electronic devices and systems, including: - Personal computers - Laptops and notebooks - Servers - Networking equipment - Industrial automation systems - Medical devices - Automotive electronics - Consumer electronics

Detailed and Complete Alternative Models

  1. AS4C64M8D2A-25BIN
  2. AS4C64M8D2B-25BIN
  3. AS4C64M8D2C-25BIN
  4. AS4C64M8D2D-25BIN
  5. AS4C64M8D2E-25BIN

Liste 10 perguntas e respostas comuns relacionadas à aplicação de AS4C64M8D2-25BIN em soluções técnicas

Sure! Here are 10 common questions and answers related to the application of AS4C64M8D2-25BIN in technical solutions:

  1. Question: What is the AS4C64M8D2-25BIN?
    Answer: The AS4C64M8D2-25BIN is a specific model of synchronous dynamic random-access memory (SDRAM) chip.

  2. Question: What is the capacity of the AS4C64M8D2-25BIN?
    Answer: The AS4C64M8D2-25BIN has a capacity of 64 megabits (8 megabytes).

  3. Question: What is the operating voltage of the AS4C64M8D2-25BIN?
    Answer: The AS4C64M8D2-25BIN operates at a voltage of 2.5 volts.

  4. Question: What is the speed rating of the AS4C64M8D2-25BIN?
    Answer: The AS4C64M8D2-25BIN has a speed rating of 25 nanoseconds (ns).

  5. Question: Can the AS4C64M8D2-25BIN be used in embedded systems?
    Answer: Yes, the AS4C64M8D2-25BIN is commonly used in various embedded systems such as industrial control systems, automotive electronics, and telecommunications equipment.

  6. Question: Is the AS4C64M8D2-25BIN compatible with different microcontrollers?
    Answer: Yes, the AS4C64M8D2-25BIN is designed to be compatible with a wide range of microcontrollers and can be easily integrated into different technical solutions.

  7. Question: Does the AS4C64M8D2-25BIN support multiple read and write operations simultaneously?
    Answer: Yes, the AS4C64M8D2-25BIN supports simultaneous multiple read and write operations, making it suitable for applications that require high-speed data access.

  8. Question: Can the AS4C64M8D2-25BIN be used in low-power devices?
    Answer: Yes, the AS4C64M8D2-25BIN has low power consumption characteristics, making it suitable for use in battery-powered or energy-efficient devices.

  9. Question: What is the temperature range for the AS4C64M8D2-25BIN?
    Answer: The AS4C64M8D2-25BIN has an operating temperature range of -40°C to +85°C, making it suitable for various environmental conditions.

  10. Question: Are there any specific design considerations when using the AS4C64M8D2-25BIN?
    Answer: When designing with the AS4C64M8D2-25BIN, it is important to consider proper decoupling, signal integrity, and timing requirements to ensure optimal performance and reliability.

Please note that these answers are general and may vary depending on the specific technical solution and application requirements.