AS4C32M16D3L-12BCN

Product Overview

Category

AS4C32M16D3L-12BCN belongs to the category of computer memory modules.

Use

It is used as a Random Access Memory (RAM) module in various electronic devices, such as computers, servers, and embedded systems.

Characteristics

• Capacity: 32 Megabytes (MB)
• Type: DDR3 SDRAM
• Speed: 1200 MHz
• Organization: 32M words x 16 bits
• Voltage: 1.5V
• Package Type: BGA (Ball Grid Array)
• Operating Temperature: -40°C to +85°C

Packaging/Quantity

The AS4C32M16D3L-12BCN memory module is typically packaged in anti-static bags or trays. The quantity per package may vary depending on the manufacturer's specifications.

Essence

AS4C32M16D3L-12BCN is an essential component for storing and accessing data quickly in electronic devices, enabling efficient and smooth operation.

Specifications

• Memory Type: DDR3 SDRAM
• Memory Size: 32 Megabytes (MB)
• Memory Organization: 32M words x 16 bits
• Data Rate: 1200 Mbps
• CAS Latency: 12
• Voltage: 1.5V
• Package Type: BGA
• Operating Temperature Range: -40°C to +85°C
• Refresh Mode: Auto-refresh and self-refresh
• Burst Length: 8

Detailed Pin Configuration

The AS4C32M16D3L-12BCN memory module has a specific pin configuration that allows it to be properly connected to the system. The detailed pin configuration is as follows:

1. VDD
2. DQ0
3. DQ1
4. DQ2
5. DQ3
6. DQ4
7. DQ5
8. DQ6
9. DQ7
10. VSS
11. DQ8
12. DQ9
13. DQ10
14. DQ11
15. DQ12
16. DQ13
17. DQ14
18. DQ15
19. VDD
20. A0
21. A1
22. A2
23. A3
24. A4
25. A5
26. A6
27. A7
28. VSS
29. A8
30. A9
31. A10
32. A11
33. A12
34. A13
35. A14
36. A15
37. VDD
38. BA0
39. BA1
40. RAS#
41. CAS#
42. WE#
43. CS#
44. VSS
45. DM0
46. DM1
47. VREF
48. VSS

Functional Features

• High-speed data transfer: AS4C32M16D3L-12BCN operates at a speed of 1200 MHz, allowing for fast and efficient data transfer.
• Low power consumption: The memory module operates at a voltage of 1.5V, reducing power consumption and contributing to energy efficiency.
• Auto-refresh and self-refresh modes: It supports automatic refreshing of data to maintain stability and reliability.
• Wide operating temperature range: AS4C32M16D3L-12BCN can operate in extreme temperature conditions ranging from -40°C to +85°C.

Advantages and Disadvantages

Advantages

• High-speed performance enables faster data access and processing.
• Low power consumption contributes to energy efficiency.
• Wide operating temperature range allows for use in various environments.
• Auto-refresh and self-refresh modes ensure data stability.

Disadvantages

• Limited capacity of 32 Megabytes may not be sufficient for certain applications requiring larger memory sizes.
• DDR3 technology is older compared to newer generations like DDR4, limiting compatibility with the latest systems.

Working Principles

AS4C32M16D3L-12BCN operates based on DDR3 SDRAM technology. It stores data in a matrix of capacitors, which can be accessed and manipulated by the system's memory controller. When the system requires data, it sends a command to the memory module, which retrieves the requested information and transfers it back to the system for processing.

The memory module uses synchronous dynamic random access memory (SDRAM) architecture, where data is stored in cells that need to be periodically refreshed to maintain their contents. The auto-refresh and self-refresh modes of AS4C32M16D3L-12BCN ensure that data integrity is maintained even during extended periods of inactivity.

Detailed Application Field Plans