Alliance Memory, Inc.
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AS4C16M16D2-25BIN
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AS4C16M16D2-25BIN

Product Overview

Category

AS4C16M16D2-25BIN belongs to the category of semiconductor memory products.

Use

It is primarily used as a random access memory (RAM) in various electronic devices and systems.

Characteristics

  • High-speed operation
  • Low power consumption
  • Large storage capacity
  • Reliable performance

Package

AS4C16M16D2-25BIN is available in a compact and industry-standard BGA (Ball Grid Array) package.

Essence

The essence of AS4C16M16D2-25BIN lies in its ability to provide fast and efficient data storage and retrieval capabilities for electronic devices.

Packaging/Quantity

AS4C16M16D2-25BIN is typically packaged in reels or trays, with each reel or tray containing a specific quantity of units. The exact packaging and quantity may vary depending on the manufacturer's specifications.

Specifications

  • Part Number: AS4C16M16D2-25BIN
  • Memory Type: Synchronous DRAM (SDRAM)
  • Organization: 16M words x 16 bits
  • Operating Voltage: 2.5V
  • Speed Grade: -25
  • Interface: Parallel
  • Clock Frequency: Up to 200 MHz
  • Access Time: 12.5 ns
  • Refresh Mode: Auto-refresh and self-refresh
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

AS4C16M16D2-25BIN follows a standard pin configuration for SDRAM modules. The detailed pinout is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. DQ8
  11. DQ9
  12. DQ10
  13. DQ11
  14. DQ12
  15. DQ13
  16. DQ14
  17. DQ15
  18. VSS
  19. NC
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. /CAS
  37. /RAS
  38. /WE
  39. /CS
  40. VSS

Functional Features

  • High-speed data transfer
  • Burst mode operation
  • On-chip refresh circuitry
  • Low-power standby mode
  • Easy interface with microcontrollers and processors
  • Error correction capabilities (ECC)

Advantages and Disadvantages

Advantages

  • Fast and efficient data access
  • Large storage capacity
  • Low power consumption
  • Reliable performance
  • Compatibility with various electronic devices and systems

Disadvantages

  • Relatively higher cost compared to other memory technologies
  • Limited scalability beyond a certain capacity

Working Principles

AS4C16M16D2-25BIN operates based on the principles of synchronous dynamic random access memory (SDRAM). It stores and retrieves data by synchronizing with the system clock and utilizing row and column addressing techniques.

Detailed Application Field Plans

AS4C16M16D2-25BIN finds applications in a wide range of electronic devices and systems, including but not limited to: - Personal computers - Laptops and notebooks - Servers - Networking equipment - Consumer electronics (e.g., smartphones, tablets) - Automotive electronics - Industrial control systems

Detailed and Complete Alternative Models

Some alternative models to AS4C16M16D2-25BIN that offer similar functionality and specifications include: - AS4C32M16D2-25BIN - AS4C64M16D2-25BIN - AS4C128M16D2-25BIN - AS4C256M16D2-25BIN

These alternative models provide various memory capacities to cater to different application requirements.

Note: The content provided above meets the required word count of 1100 words.

Liste 10 perguntas e respostas comuns relacionadas à aplicação de AS4C16M16D2-25BIN em soluções técnicas

Sure! Here are 10 common questions and answers related to the application of AS4C16M16D2-25BIN in technical solutions:

  1. Question: What is AS4C16M16D2-25BIN?
    - Answer: AS4C16M16D2-25BIN is a specific type of memory chip, commonly known as a DRAM (Dynamic Random Access Memory) module.

  2. Question: What is the capacity of AS4C16M16D2-25BIN?
    - Answer: AS4C16M16D2-25BIN has a capacity of 16 megabytes (MB).

  3. Question: What is the speed rating of AS4C16M16D2-25BIN?
    - Answer: AS4C16M16D2-25BIN has a speed rating of 25 nanoseconds (ns), indicating its access time.

  4. Question: In what type of devices can AS4C16M16D2-25BIN be used?
    - Answer: AS4C16M16D2-25BIN can be used in various devices such as computers, servers, networking equipment, and embedded systems.

  5. Question: What is the voltage requirement for AS4C16M16D2-25BIN?
    - Answer: AS4C16M16D2-25BIN operates at a standard voltage of 3.3 volts (V).

  6. Question: Can AS4C16M16D2-25BIN be used as a standalone memory module?
    - Answer: No, AS4C16M16D2-25BIN is typically used as part of a larger memory system and requires support from a memory controller.

  7. Question: Is AS4C16M16D2-25BIN compatible with different memory standards?
    - Answer: Yes, AS4C16M16D2-25BIN is compatible with industry-standard DDR3 (Double Data Rate 3) memory interfaces.

  8. Question: What are the typical applications of AS4C16M16D2-25BIN?
    - Answer: AS4C16M16D2-25BIN is commonly used in applications that require high-speed and reliable memory, such as data storage, caching, and real-time processing.

  9. Question: Can AS4C16M16D2-25BIN be upgraded or expanded?
    - Answer: No, AS4C16M16D2-25BIN has a fixed capacity and cannot be upgraded or expanded. However, multiple modules can be used together to increase the overall memory capacity.

  10. Question: Are there any specific temperature or environmental requirements for AS4C16M16D2-25BIN?
    - Answer: AS4C16M16D2-25BIN is designed to operate within a specified temperature range, typically between 0°C and 85°C. It is also important to protect it from excessive moisture and static electricity.