AS4C128M16D3LB-12BINTR

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-density storage capacity
  • Low power consumption
  • Fast data transfer rate
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM) chip
• Packaging/Quantity: Individually packaged, quantity varies based on customer requirements

Specifications

• Part Number: AS4C128M16D3LB-12BINTR
• Organization: 128 Megabit x 16
• Speed: 12ns
• Voltage: 1.8V
• Interface: Parallel
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C128M16D3LB-12BINTR chip has a total of 60 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VSS | Ground | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 59 | DQ14 | Data input/output bit 14 | | 60 | DQ15 | Data input/output bit 15 |

Functional Features

• High-speed data access and transfer
• Non-volatile storage capability
• Low power consumption
• Error correction capabilities
• Refresh mechanism for maintaining data integrity

Advantages and Disadvantages

Advantages

• High-density storage capacity allows for large amounts of data to be stored
• Fast data transfer rate enables quick access to stored information
• Low power consumption helps conserve energy
• Error correction capabilities enhance data reliability

Disadvantages

• Relatively higher cost compared to other memory technologies
• Volatile memory requires constant power supply to retain data

Working Principles

The AS4C128M16D3LB-12BINTR is a dynamic random access memory (DRAM) chip. It stores data in capacitors within its memory cells, which need to be periodically refreshed to maintain the stored information. When data is read from or written to the chip, it goes through a series of address decoding and multiplexing operations to access the desired memory location.

Detailed Application Field Plans

The AS4C128M16D3LB-12BINTR chip finds applications in various electronic devices that require high-speed and high-density memory storage. Some common application fields include: - Personal computers - Servers - Networking equipment - Mobile devices - Automotive electronics

Detailed and Complete Alternative Models

• AS4C128M16D3LB-12BCNTR
• AS4C128M16D3LB-12BCINTR
• AS4C128M16D3LB-12BCN
• AS4C128M16D3LB-12BCIN

These alternative models offer similar specifications and functionality to the AS4C128M16D3LB-12BINTR chip, providing customers with options based on their specific requirements.

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